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TI and Ericsson will increase the degree of integration of 3G-making

Tendency to increase the degree of integration into platforms for mobile phones that resulted from the desire of manufacturers to reduce the cost of budgetary decisions, can be extended to products of a higher level. In particular, the company Texas Instruments, known for its single-chip platforms, has signed an agreement with Ericsson to jointly develop 3G-devices, which will be used TI OMAP processors and radio frequency technology Ericsson.

TI and Ericsson collaborate with each other for nearly 20 years. The agreement will create a platform for a more preferred is the use of open source operating systems. The appearance of the first fruits of a collaborative effort between the two companies is expected in the second half of 2008. This is supposed to be machines with support for high-speed data HSPA (High Speed ​​Packet Access), providing capacity 7.2 Mbit / s are obtained, and 2.9 Mbit / s – for the information.

According to analysts, the agreement Ericsson and TI could have a major impact on the industry of mobile communication, as would mark a transition to a new business model in which there will be no place manufacturers of small parts, which are obviously unlikely to be happy. This same business model and are attracted competitors such TI, like Qualcomm, Infineon and Freescale. On the other hand, the new business models, manufacturers of mobile phones themselves will be able to concentrate on the important aspects of their creations, in both appearance and design, graphical user interface, etc.

– Texas Instruments single-chip solutions for mobile phones Source

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