Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of today’s PC have the proud designation of “dual” or “quad.” However, at the time of performance increase by increasing the number of cores on a chip will face the same limitations that are characteristic for increasing degree of integration of a single nucleus.
Three-dimensional
processors are based on the idea of multi-core chips. But they placed a different way – vertically, not side by side. The advantage is that the entire surface of one computing element can be connected to the next layer with the number of connections up to 100 thousand per mm2. Many short wires lead to increased bandwidth between the cores, reducing power consumption and heat dissipation. As explained by John R. Tom (John R. Thome) of the EPFL, the goal is not only increasing performance, but also in the environment: “The U.S. data centers consume is 2% of all energy. From this figure doubling every five years to supercomputers 2100 theoretically will require all electricity produced in the United States. ”
3D-processors use less power and generate less heat, but they are still far from room temperature. Tom developed a revolutionary cooling system, capable of significantly lower heat dissipation. A key element – located between the layers of three-dimensional chip channels 50 nm in diameter. They are filled with cooling liquid, the heating output from the CPU to the state of vapor. Then it condenses and the liquid is fed back into the processor. The prototype technology should be tested next year. But before the introduction of consumer electronics will take several years. It is assumed that the 3D-processors fall into the bowels of supercomputers by 2015, and an innovative cooling solution to hit the market in 2020
– New materials for silicon transistors;
- Nanotransistors “with clear boundaries” promise new opportunities;
- IT-Tales: Electronics, 2020 – Life after death of silicon. Source
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
Upon reaching a temperature of about 85 ° C significantly increases the likelihood of unstable operation of semiconductor components, including processors. To overcome this limit, researchers at the Federal Polytechnic School of Lausanne (Ecole Polytechnique Fédérale de Lausanne, EPFL) in collaboration with IBM proposed project CMOSAIC solution using the technology of multi-core chips. Most of [...]
