3M and IBM collaborate on 3D packaging of semiconductors (IBM)

3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips.

This so-called stacking a much higher level of integration with IT systems and consumer electronics would be. Processors in the future could be very closely with main memory and network components to connect a silicon chip. IBM expects that these chips to a thousand times faster than the fastest microprocessors available today. So much more powerful smartphones, tablets, computers and games consoles were flexibility in design.

“Today’s chips, including those with 3D transistors are de facto 2D chips are still very flat structures,” said Bernard Meyerson, vice president at IBM Research. “Our scientists intend to develop materials that allow us to bring very large computing power in a new form factor – the ‘silicon-Skyscraper’ We believe that we can further develop the current status in the packaging business and thereby a new class. semiconductors create, the higher speed and more opportunities provides, combined with low energy consumption. This key requirements of many manufacturers, particularly suppliers of Tablets and Smartphones. “

Many types of semiconductors today require packaging and connection techniques can be applied only to individual chips. 3M and IBM, however, want to develop adhesives that can be used for the entire silicon wafer and with which so hundreds or thousands of chips can be coated on a train. Statements about when the technology will be ready for the market, have not made the company.

To bring the efforts chips in the third dimension, referred to as 3D packaging. Joint research by 3M and IBM wants to solve some of the most difficult technical challenges that arise during the transition to true 3D chip forms. For example, new types of adhesives are required. You have to pay heat efficiently through a tightly packed stack and keep away from heat sensitive components such as logic circuits.

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]

3M and IBM collaborate on 3D packaging of semiconductors (IBM) 3M and IBM will jointly develop adhesives, semiconductors can be used to obstruct each other. The new class of materials is the first time make it possible to construct commercial microprocessors from more than 100 overlapping but separate chips. This so-called stacking a much higher [...]